Introduction to Ansys HFSS 3D Layout15 Septembrie 2020

Ora: 11:00 (Romania)

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.

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Ansys 2021 R1: CFX Update9 Martie 2021

Ora: 18:00 (Romania) This webinar highlights every major Ansys CFX enhancement offered throughout the past few releases. New capabilities and innovative features from these releases will help boost productivity and enable more accurate results, including: GPU-accelerated animations for transient... ...

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Differential Via Optimization with Ansys HFSS 3D Layout and Ansys optiSLang11 Martie 2021

Ora: 17:00 (Romania) This webinar highlights how to use Ansys optiSLang to gain the most insight into a HFSS 3D Layout differential via design for performance optimization. Additionally, we will discuss optiSLang’s role in analyzing how manufacturing tolerances... ...

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