Introduction to Ansys HFSS 3D Layout15 Septembrie 2020

Ora: 11:00 (Romania)

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.

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How to Troubleshoot, Qualify and Quantify Noise, Vibrations and Sound Quality in the Rail Industry31 Martie 2021

Ora: 11:00 (Romania) This webinar is for acoustics and vibration teams working in railway industries, for part suppliers and OEMs. Based on test measurements and CAE simulations, this webinar will demonstrate how Ansys tools are used to troubleshoot, qualify... ...

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Ansys 2021 R1: Ansys Mechanical Update16 Martie 2021

Ora: 11:30 (Romania) Ansys 2021 R1 delivers cutting-edge improvements to Ansys Mechanical, including a wide range of new technologies and capabilities to equip engineers with easier workflows, speed development, enhance efficiency and increase reliability. Advancements in meshing, solvers and... ...

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