Thermal Management for Power Electronics22 Septembrie 2020

Ora: 09:00 (Romania)

Ansys Icepak provides thermal management and fluid flow solutions for many types of electronic design applications, including high-power electronics. Icepak is integrated in Ansys Electronics Desktop, enabling comprehensive electronics simulation and design capabilities. This webinar showcases Icepak’s solutions for power electronics.

  • Learn thermal management solutions for applications such as IGBTs, planar transformers, bus bars, PCBs, power inverters and wireless power transfer devices.
  • Discover multiphysics and electro-thermal-mechanical solutions for high-power electronics.
  • Understand reduced order modeling (ROM) and systems modeling for high-power electronics.
  • Receive expert insights on PCB reliability solutions.

 

Link

 

Contactaţi-ne

tensor Tel/Fax: 021 444 23 78
Mobil: 0744 310 929
office[at]tensor.ro

© Copyright 2017 Tensor SRL. Toate drepturile rezervate. Design și programare Vectorpixel

RO EN