Thermal Management for Power Electronics22 Septembrie 2020

Ora: 09:00 (Romania)

Ansys Icepak provides thermal management and fluid flow solutions for many types of electronic design applications, including high-power electronics. Icepak is integrated in Ansys Electronics Desktop, enabling comprehensive electronics simulation and design capabilities. This webinar showcases Icepak’s solutions for power electronics.

  • Learn thermal management solutions for applications such as IGBTs, planar transformers, bus bars, PCBs, power inverters and wireless power transfer devices.
  • Discover multiphysics and electro-thermal-mechanical solutions for high-power electronics.
  • Understand reduced order modeling (ROM) and systems modeling for high-power electronics.
  • Receive expert insights on PCB reliability solutions.

 

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Optical and Radiometric Simulation for Biomedical Applications20 Octombrie 2020

Ora: 12:00 (Romania) The employment of optical methods in biomedical technologies has grown in recent years. Light used for imaging, diagnostics or even therapy is an ideal tool because it is powerful, less expensive than CT or PET imaging... ...

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Optimizing Speed with HFSS Regions in SIwave6 Octombrie 2020

Ora: 11:00 (Romania) Learn how the speed and accuracy of Ansys SIwave can be improved by leveraging HFSS Regions in SIwave, a cutting-edge technique for supporting high-speed printed circuit board (PCB) channel design requirements. This presentation compares the technique... ...

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