Introduction to Ansys HFSS 3D Layout15 Septembrie 2020

Ora: 11:00 (Romania)

Learn how Ansys HFSS 3D Layout simplifies modeling of layered structures such as printed circuit boards (PCB) and high-speed components. HFSS 3D Layout is ideal for designers who work with layered geometry or layout high-speed components, including on-chip embedded passives, IC packages and PCB interconnects. These types of designs can be easily modeled in the HFSS electrical layout environment and simultaneously simulate all 3D features, such as trace thickness, etching, bondwires, vias, solder bumps and solder balls. Geometry such as trace width can be easily parameterized and optimized using the integrated Ansys Optimetrics tool within the HFSS 3D Layout interface.

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Ansys 2020 R2: Electric Motors Enhancements22 Septembrie 2020

Ora: 18:00 (Romania) This webinar showcases the many cutting-edge electric motor design simulation capabilities delivered in Ansys 2020 R2, including powerful new features that enable you to solve large and complex electric motor designs faster than ever before. ... ...

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Thermal Management for Power Electronics22 Septembrie 2020

Ora: 09:00 (Romania) Ansys Icepak provides thermal management and fluid flow solutions for many types of electronic design applications, including high-power electronics. Icepak is integrated in Ansys Electronics Desktop, enabling comprehensive electronics simulation and design capabilities. This webinar showcases... ...

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