ANSYS 19 - Icepak Product Update1 Martie 2018

Ora: 18:00 (Romania) (va fi inregistrat, reveniti pe site-ul nostru daca nu reusiti sa participati online atunci)

Descriere webinar: Electronic devices today contain many more components within a much smaller form factor than ever before. Even though advances have been made with smaller processor technologies to decrease power draw, the need to predict heat dissipation is now as important as the electrical design itself. More and more layout designs are being done alongside thermal analysis. Attend this webinar to learn how ANSYS 19 integrates the ANSYS Icepak electronics cooling product directly into the ANSYS Electronics Desktop. This advancement modernizes and enhances the workflow that our electronics customers are already using. It opens new possibilities for component and system-level multiphysics, automation and robust design. Icepak is in the Electronics Desktop alongside ANSYS HFSS, ANSYS Q3D Extractor and ANSYS Maxwell, enabling a smoother, more robust overall workflow for thermal analysis coupled to electromagnetics. Register now to learn about Improvements to the SIwave <--> Icepak solution for ECAD, including automated report generation that helps maximize customer design efficiency.


Metode de evaluare a acţiunii vântului asupra construcţiilor7 Mai 2018

Va invitam cu drag la: Workshop: Metode de evaluare a acţiunii vântului asupra construcţiilorWorkshopul îşi propune prezentarea metodelor de evaluare a acţiunii vântului şi a efectelor induse asupra construcţiilor. Sunt prezentate bazele teoretice şi exemple de calcul, folosind abordarea... ...

ANSYS Workbench Additive - Seamless Workflow for Additive Manufacturing28 Martie 2018

Data: March, 28 2018 (28 martie 2018)Ora : 4:00 PM Description: Attend this webinar to learn about ANSYS` new metal powder-bed additive simulation capabilities inside Mechanical Workbench. The simulation process includes topology optimization, manipulation and cleanup of STL files,... ...



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